Mga produkto
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High-Precision na Single-Side Polishing Equipment
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Double-Sided Precision Grinding Machine para sa SiC Sapphire Si wafer
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Multi-Wire Diamond Sawing Machine para sa SiC Sapphire Ultra-Hard Brittle Materials
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SICOI (Silicon Carbide on Insulator) Wafers SiC Film ON Silicon
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Diamond Wire Cutting Machine para sa SiC | Sapiro | Kuwarts | Salamin
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Robotic Polishing Machine – High-Precision Automated Surface Finishing
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Ion Beam Polishing Machine para sa sapphire SiC Si
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JGS1, JGS2, at JGS3 Fused Silica Optical Glass
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BF33 Glass Wafer Advanced Borosilicate Substrate 2″4″6″8″12″
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High-Purity Fused Quartz Wafers para sa Semiconductor, Photonics Optical Applications 2″4″6″8″12″
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Sapphire Wafer Blank High Purity Raw Sapphire Substrate para sa Pagproseso
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Adjustable Wafer Box – Isang Solusyon para sa Maramihang Laki ng Wafer